VGP-D4B现货 in stock! 欢迎来电咨询~！！

VGP-D4B,

VGP-D4B

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电子产品的机器大规模生产带动了SMT蓬勃发展,贴片机的广泛运用又对SMD电子元器件规模化标准封装提出了进一步的要求.把SMD元件放入载带,再用盖带通过封装的办法封装起来就是常说的编带.因为编带机的控制方式简易,早前的遍带机是用继电器搭起来的控制系统控制的.

　　半自动编带机

　　后来随着PLC和单片机控制板的价格下降,越来越多的编带机采用了PLC或单片机板+普通按钮的控制方式.只是单片机控制板给人简易,不稳定的感觉,所以用PLC的编带机厂商还是要多些.后来由于有些厂家用触摸屏把按钮替代了,这样编带机控制箱面板上的按钮就大大减少了,同时接线也方便许多.上面说的都是半自动编带机,要人工放料.再后来出现了全自动编带机,它克服了大量人工放量带来的高成本和不稳定性.当然全自动编带机也有缺点,它不是每一种产品都可以封装,只是有针对性产品才可以.

　　全自动编带机

　　二 、编带机的电气组成

　　半自动按钮式编带包装机的主要控制部分有:

　　1、 一个拉带马达,一般的是调速马达,也有用步进马达.

　　2 、一个压带电磁,两个刀头电磁阀,一个总电磁阀.

　　3 、两个刀头温度.

　　信号输入部分:

　　1 、一个启停按钮,脚踏启停也并接一块.

　　2 、一个刀头升降按钮.

　　3 、一个连续/寸动/放气三选按钮.

　　4 、一个计数SENSOR,一个料控SENSOR.

　　5、 一个压带按钮.

　　6 、两个热电偶SENSOR.

　　电气元件主要有:

　　1、PLC一个(I/O点数要求大于8/4).

　　2、温控制器两个.

　　3、调速马达一个.

　　4、四个电磁阀.

　　5、 两个固态继续电器(温控),一个普通继电器(调速马达),一个总的空气开关.

　　6、一个计数器(如果改用触摸屏式,则可以省去).

　　7、两个光纤SENSOR(一个计数,一个作为料控).

　　三、编带机的工作过程和关键点说明

　　编带包装机电和气接好后,如果是热封装的话,让刀升到合适的温度,调节好载带和气源气压. 用人工或自动上上料设备把SMD元件放入载带中,马达转动把

　　载带拉到封装位置,这个位置盖带在上,载带在下,经过升温的两个刀片压在盖带和栽带上,使盖带把载带上面的SMD元件口封住,这样就达到了SMD元件封装的目的.然后收料盘把封装过的载带卷好.

　　也有的不是热封装,是用冷封.所胃冷封,就是不用加热就可以使盖带和载带粘在一块,这时候用的盖带要有粘性.封装前,载带一般要经过两个SENSOR,一个是计数用的,一个是用来做料控的.料控是要检测载带里面有没有漏放元件.如果检测到有漏放,那么编带机的马达立刻停下不转,同时刀头也要生到上面的位置.计数SENSOR一般是用光纤,也用而且要求反应速度要快,这样才不会漏计数.计数SENSOR可以数载带的边孔,也可以数成型凹槽.数边孔的话要折算回来才能是正确的SMD个数.由于普通的光纤SENSOR都上两三百块,所以有些厂商干脆用欧姆龙的凹槽式光电SENSOR,在载带边孔上装一个有齿轮,通过一个轴带动另一个齿轮,后面一个齿轮的齿用来感应凹槽式光电SENSOR.这样一来,载带前进,带动了齿轮的转动,也就能计载的边孔数.
 

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