晶圆研磨GNX200BP晶圆背抛
——又称晶圆减薄/晶圆抛光（Wafer Grinding）


GNX200BP晶圆研磨/晶圆背抛概要
GNX200BP Wafer Grinding is a fully automatic continuous downfeed grinding machine. Wafers are handled through the machine by a robot, and load/unload arms. Two different stations are used for wafer cleaning after the final grind station. Chuck speed, grinding wheel, and grind spindle downfeed rate speeds can be used to manipulate grinder throughput, surface finish, and wheel life. A two-point in-process gauge measuring system controls wafer thickness under grind spindles 1 and 2. A three-point grind spindle angle adjustment mechanism is utilized for easily maintaining wafer profile (ttv); with the option a motorized adjustment. After completion at the grind station, the wafer transfers to Polish unit automatically. The local polishing unit removes subsurface damage for increased wafer die strength, and the ability to handle final thickness of 50 microns.


GNX200BP晶圆研磨/晶圆背抛规格
Maximum wafer-machining diameter of wafer 64” or 8”
Grinding Spindle:  Bearing type                 Air bearing, maximum 3600rpm
                   Motor                        2.2kw,4P,high frequency motor 
                   Rapid feed speed             200mm/min
                   Grind feed speed         1 to 999 μm/min 
Grinding wheel size                         ?250 mm
Index Table: Number of work spindles            3 
             Work spindle Bearing type          Mechanical Bearing, or Air Bearing (optional) 
             Speed of Work Spindles         1 to 600 rpm
Automatic Sizing Device:
        Wafer thickness measuring system        2 point contact in-process gauge 
        Wafer minimum setting size              1 μm 
        Wafer size display range         0to 1.2 mm; extended range software available
Table Cleaning Device (Grinder side) Water + Ceramic block
Wafer Cleaning Unit (Grinder side)         Water + brush, and spin/rinse dry station
Number of Cassettes                         2 stations for each unit (Grinder & Polish unit)
Polish head                                     3 Kw AC servo motor for 10 – 460 rpm 
Oscillation speed                               100–8,000 mm/min.
Head Load                                       50 –999 g//cm2 
Pad size                                 200mm O.D.
Polish table speed                              3 Kw AC servo motor for 50 – 200rpm 
Vacuum Chuck material                           Alumina ceramics (dedicate size of wafer)
Chuck cleaning                                 Brush + Water
Wafer cleaning                                 N.C.W + DI water for Polish surface & Air blow spin dry


GNX200BP晶圆研磨/晶圆背抛相关产品：
衡鹏供应
GDM300晶圆研磨/晶圆减薄/晶圆抛光/晶圆背抛/Wafer Grinding